What is MicroSpray™ .....Photoresist in a spray can!

Microspray™ is based on long proven, mature, novolak technology. It is ideally suited for developmental applications including perforated, 3-dimensional and other substrates that have severe topography, deep V grooves, back side wafer protection or other difficult MEMS features

Gwen Donahue, MEMS Engineer with MicroCHIPS, Inc. says, "I was very pleased with the results of MicroSpray™. The coverage of the 100um sidewalls is exactly what I wanted to see on these wafers and I was unable to get this result using spin on resist."

Harris Miller, R&D Product Mgr for Microspray™, states that "The cost of ownership is of course very low, since no coating equipment is needed."

Product attributes:

• No coating equipment required
• Minimal waste
• Coats over non-planar surfaces
• Coats irregularly shaped substrates
• Covers the sidewalls and edges of trenches
• Produces uniform coatings on perforated substrates

Applications for microSpray:

• Conformal coatings
• Backside coatings
• Protective coatings
• MEMS devices
• Decorative etching
• Prototyping

Now available with our SU-8 formulation.