LOR/PMGI Product Selection Guide

Printable version (.pdf)

  1. Adhesion loss can occur with reworked substrates when soft-baking the PMGI with temperatures lower than 180"+ C.
  2. Intermixing can occur with Ethyl Lactate based resists at temperatures below 180"+ C.
  3. A Cap-On Process or an additional exposure of the PMGI layer can be used to achieve excellent results.
  4. Compatible up to 3um in thickness.
  5. High temperatures > 250"+ C needed for reflow.

    Copyright © MicroChem Corp.