 |
 |
 
|
Technology Roadshow for 3D Integration and Packaging
Durham, NC - May 12th, 2008
Durham Doubletree
Harris Miller, Principal Engineer for New Product Development, MicroChem Corp. will be speaking on "KMPR - High-resolution DRIE and ultra-high aspect ratio plating resist for TSV and 3D packaging"
|
|
|
Technology Roadshow for 3D Integration and Packaging
Dallas, TX - May 14th, 2008
Dallas Embassy Suites Galleria
Harris Miller, Principal Engineer for New Product Development, MicroChem Corp. will be speaking on "KMPR - High-resolution DRIE and ultra-high aspect ratio plating resist for TSV and 3D packaging"
|
|
|
Technology Roadshow for 3D Integration and Packaging
Dallas, TX - May 15th, 2008
Doubletree at SJC airport
Harris Miller, Principal Engineer for New Product Development, MicroChem Corp. will be speaking on "KMPR - High-resolution DRIE and ultra-high aspect ratio plating resist for TSV and 3D packaging"
|
|
|
|
