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MicroChem Negative Epoxy Resists

MicroChem epoxy resists consist of chemically amplified, epoxy based negative resists that are highly functional, optically transparent and photo imageable to near UV (365nm) radiation. Cured films or microstructures are very resistant to solvents, acids and bases and have excellent thermal and mechanical stability, making them well suited for fabricating permanent structures such as pixel walls, fluidic channels and nozzles, micro arrays and spacers.

SU-8 2000 Series

  • Film Thickness 0.5 - 200 microns
  • >10:1 aspect ratio
  • Better wetting than standard SU-8
  • Higher throughput than standard SU-8

SU-8 Series

  • Film thickness 2 - 200 microns
  • I-Line processing
  • Suited for permanent applications

SU-8 3000 Series

  • Film thickness 5 - 120 microns
  • >5:1 aspect ratio
  • Improved adhesion on difficult substrates such as oxides and nitrides
  • HMDS prime

KMPR – 1000 Series

  • Temporary or permanent applications
  • Film thickness: 2 - 75µm
  • Aqueous developable
  • Electroplating & etch mask
  • HMDS prime





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