Products
MicroSpray™
MicroSpray™ is based on long proven, mature, novolak technology. It is ideally suited for developmental applications including perforated, 3-dimensional and other substrates that have severe topography, deep V grooves, back side wafer protection or other difficult MEMS features. MicroSpray is also available with SU-8.
Gwen Donahue, MEMS Engineer with MicroCHIPS, Inc. says, "I was very pleased with the results of MicroSpray. The coverage of the 100µm sidewalls is exactly what I wanted to see on these wafers and I was unable to get this result using spin on resist."
Material uses:
- Conformal coatings
- Backside coatings
- Protective coatings
- MEMS devices
- Decorative etching
- Prototyping
|
 |
Material attributes:
- No coating equipment required
- Minimal waste
- Coats over non-planar surfaces
- Coats irregularly shaped substrates
- Covers the sidewalls and edges of trenches
- Produces uniform coatings on perforated substrates
|
 |
|
 |
Patterned through wafer vias
|
|
Micro-machined cavities |
 |
| 5 µm coating of MicroSpray™ in a 25 µm deep silicon cavity |
|
