Products

Dow (Rohm & Haas Electronic Materials)

MicroChem Corp. is now a distributor for both semiconductor technology and advanced packaging products for Dow Electronic Materials.

Our long established semiconductor technology line includes:

• Broadband resists such as the S1800 and SPR 3600 series
• i-line resists such as the SPR 955 CM and SPR 220
• DUV resists such as the UV 26, UV 210, UV 110 and UVN 30
• Ancillary materials including developers, ebr products and removers

Our newly offered line of advanced packaging materials includes:

• Thick resists such as InterVia BPP-10 and BPR 100
• Electrophoretic resists such as InterVia 3D-N and InterVia 3D-P (ED Resists for Wafer Applications — Requires PowerPoint)
• Dielectrics such as InterVia 8000, Cyclotene 3000 and Cyclotene 4000 used in Immersion Develop and Puddle Develop
• Plating chemistry such as Ultrafill 3001 and Ultrafill 3003, Nanoplate 3200, Nikal BP RTU and Everon BP
• Ancillary materials such as Nutraclean 68, developers, removers and plating bath additives