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LOR/PMGI Product Selection Guide

Attributes

LOR A

LOR B

SF

SF Slow

Undercut Geometry

< 0.35um

 

 

0.35 - 0.5um

 

 

0.5 - 1um

 

 

> 1 um

 
3
3

Thickness Range

< 100nm

 

 

0.1um - 1um

1 - 5 um
4
3
3

Temperature Range

< 150 C

 

 

 

 

150 - 190 C
1, 2
1, 2

> 190 C

 

 

Developer Compatibility

0.26N MIF

 

0.24N MIF

MIB

 

 

 

Resist Solvent Compatibility

Ethyl Lactate
2
2
2
2

PGMEA

2-Heptanone

Cyclohexanone

Substrate Compatibility

Si

Glass

NiFe

III-V Metals

Au

Coating

Conformal

Planar & Via-fill

 

 
5
5

Recommended

Some Compatibility

Printable version (.pdf)

  1. Adhesion loss can occur with reworked substrates when soft-baking the PMGI with temperatures lower than 180º C.
  2. Intermixing can occur with Ethyl Lactate based resists at temperatures below 180º C.
  3. A Cap-On Process or an additional exposure of the PMGI layer can be used to achieve excellent results.
  4. Compatible up to 3um in thickness.
  5. High temperatures > 250º C needed for reflow.

 
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